东莞市恒迈实业有限公司

GENERAL  D*CRIPTION:

This is an one component,solvent free,hot curing system,rigid epoxy adhesive and insulation for blob *.It is suitable for the high quality electrical industry.The material can be mixed with solvent to lowe the viscosity.

PROPERTI*  OF  UNCURED  MATERIAL:      (@25℃)

1.Appearance:                   Black dense Liquid                   

2.Viscosity:                    

3.Density:                                

4.Shelf  Life:                   

5.Gel  Time:                   

6.Curing  Time:               

PROPERTI*  OF  CURED  (Curing  Condition: 120℃/2 Hrs)

Hardness                          Shore D      91            ASTM    D  2240

H.  D.  T.                        ℃           155           ASTM    D   684

Moisture  absorption             @100℃/1 Hrs    0.27         ASTM     D   570

Gl* transition temperature            ℃           140          ASTM    D    256

Thermal shock (no cracking)           10 cycles    -55 to130℃   ASTM     D   1674

Cofficient of linear

Themal expansion                     cm/℃      4.6X10ˉ4       ASTM    D   150

Thermal  conductivity               cal/cm.sec℃    8.2×10ˉ4     ASTM    D   1674

Linermal shremkage                   ％            0.2       ASTM    D   2566

                                                   15

Volume Resistivity                    ohm-cm       ＞10      ASTM    D    257

Dielectric Bd Strength                  KV/mm       ＞20       2mm

Dielectric Factor                       ％            0.6     ASTM    D   1674

*TE:

*Keep in cool low temperature(@5℃or below) avoid moisture and sun shine directiy, to keep long using.

*Avoid conlact of the skin ,eyes and clothes,in case of contact,just wash wish soap and water immediay.